Semiconductor Metrology / Production Equipment

XRF / EDX / WDX

Product Description

  • XRF / EDX / WDX
  • Wafer Thin Film Metal Thickness & Composition Measurement
  • Handheld XRF
  • EDX Elemental Analysis, Jewelry, RoHs, WEEE applications
  • Wavelength Dispersive XRF (WDX)

AAS / ICP

Product Description

  • AAS / ICP
  • Sequential Inductively Coupled Plasma Spectrometer (ICP)

SEM

Product Description

  • The visual system of Scanning Electron Microscope
  • Surface analysis

Wafer Thickness / Film Stress

Product Description

  • Wafer Film Stress / Film Thickness Measurement
  • Low-k / Cu Material Stress Hysteresis / Thermal Desorption Measurement
  • Sheet Resistivity, Rs / Leakage for Ultra-Shallow Junction Measurement
  • Thin Wafer Thickness / Roughness / Warp / Bump Height Measurement
  • 4-Point Bend Environmental Low-k Adhesion Tester
  • Surface 3D Video Microscope and Surface Profiler instrument

Wafer Grinding

Product Description

  • Wafer Grinding, Thinning & Polishing Machine
  • Ultra-Thin Wafer Thinning Machine
  • Wafer Edge Grinding Machine

Wafer UV Curing / Mounter / Cleaning

Product Description

  • Vacuum Wafer Mounter Machine
  • Wafer UV Curing Machine
  • Wafer Cleaning Machine

Spin Coater / Etcher / Mask Aligner

Product Description

  • Spin Coater / Spin Etcher / Developer / Spin Cleaner
  • Mask Aligner / Mask Cleaner / Plasma Cleaner
  • Lift off system

Laser Marking / Cutting

Product Description

  • Laser marking on wafer
  • Laser cutting / marking system for sheet metal, plastic, leather, wood

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